Samsung will reportedly introduce a series of next-generation memory products at the upcoming 2024 IEEE International Solid State Circuits Conference.
In addition to its previously announced GDDR7 memory, which will appear at the High Density Memory and Interfaces session, the South Korean tech giant will also unveil an ultra-fast DDR5 memory chip.
The high-capacity 32Gb DDR5 DRAM was developed using 12 nanometer (nm) class process technology to deliver twice the capacity of 16Gb DDR5 DRAM within the same package size.
Lower energy consumption
While Samsung hasn't provided much information about the DDR5 chip it will be presenting at the conference, we do know that the DDR5 I/O speed is up to 8000 Mbps per pin and it has been created with a symmetrical tiling architecture using the fifth Samsung generation. Generation 10nm class foundry node, specially designed for DRAM products.
When the new DDR5 product was first announced in late 2023, SangJoon Hwang, executive vice president of DRAM products and technology at Samsung Electronics. said: “With our 32Gb class 12nm DRAM, we have secured a solution that will enable DRAM modules of up to 1 terabyte (TB), allowing us to be ideally positioned to meet the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data. “We will continue to develop DRAM solutions through differentiated design technologies and processes to break the limits of memory technology.”
Previous 128GB DDR5 DRAM modules, made with 16Gb DRAM, required the Through Silicon Via (TSV) process. However, the new 32Gb DRAM allows the production of a 128GB module without the TSV process, reducing power consumption by approximately 10%, according to Samsung. This makes it a welcome solution for data centers currently struggling with the increasing power demands of AI.
Samsung's latest DDR5 technology enables the creation of 32GB and 48GB DIMMs at DDR5-8000 speeds in single-rank configurations and also supports 64GB and 96GB DIMMs in dual-rank configurations. We will no doubt know more about the new memoir once the conference is underway.
