Micron has introduced its UFS 4.0 mobile storage solution. The new SSD, delivered in the world's smallest UFS package at just 9×13 millimeters, is built with Micron's advanced 232-layer 3D NAND technology and offers up to 1TB of capacity.
Unveiled at Mobile World Congress 2024, the UFS 4.0 solution promises faster, more responsive experiences on flagship smartphones and accelerates data-intensive experiences with sequential read speeds of up to 4,300 MBps and sequential write speeds of 4,000 MBps. MBps, doubling the performance of previous generations.
This increase in speed allows users to launch productivity, creativity and artificial intelligence applications more quickly. Micron claims that LLMs in generative AI applications can load up to 40% faster.
Optimized performance
The reduced package size potentially paves the way for the design of ultra-thin, energy-efficient smartphones and allows for larger batteries.
Micron's UFS 4.0 includes proprietary firmware features such as High Performance Mode (HPM) that reportedly optimizes performance during heavy smartphone use, resulting in a more than 25% improvement in speed at launch multiple applications. It also includes One Button Refresh (OBR) that automatically cleans and optimizes data.
The Zoned UFS (ZUFS) feature allows the host to specify different zones where data can be stored, potentially improving the usability of the device over time.
Micron UFS 4.0 will be available in 256GB, 512GB, and 1TB capacities, but there is no information on pricing at the moment.
