South Korean memory giant SK Hynix has announced that it has begun mass production of the world's first 12-layer HBM3E, with a total memory capacity of 36GB, a huge increase from the previous 24GB capacity on the market. 8 layer configuration.
This new design was made possible by reducing the thickness of each DRAM chip by 40%, allowing more layers to be stacked while maintaining the same overall size. The company plans to start bulk shipments in late 2024.
HBM3E memory supports a bandwidth of 9600 MT/s, which translates to an effective speed of 1.22 TB/s when used in an eight-stack configuration. The improvement makes it ideal for handling LLM and AI workloads that require speed and high capacity. The ability to process more data at faster speeds allows AI models to run more efficiently.
Nvidia and AMD hardware
For advanced memory stacking, SK Hynix employs innovative packaging technologies, including Through Silicon Via (TSV) and the Mass Reflow Molded Underfill (MR-MUF) process. These methods are essential to maintain the structural integrity and heat dissipation necessary for stable, high-performance operation in the new HBM3E. Improvements in heat dissipation performance are particularly important for maintaining reliability during intensive AI processing tasks.
In addition to its increased speed and capacity, the HBM3E is designed for greater stability, and SK Hynix's patented packaging processes ensure minimal deformation during stacking. The company's MR-MUF technology allows for better internal pressure management, reducing the chances of mechanical failure and ensuring long-term durability.
The first samples of this 12-layer HBM3E product began in March 2024, and Nvidia's Blackwell Ultra GPUs and AMD's Instinct MI325X accelerators are expected to be among the first to use this improved memory, taking advantage of up to 288 GB of HBM3E for support complex AI calculations. SK Hynix recently turned down a $374 million upfront payment from an unknown company to ensure it could provide Nvidia with enough HMB for its in-demand AI hardware.
“SK Hynix has once again pushed technological boundaries, demonstrating our leadership in the AI memory industry,” said Justin Kim, President (Head of AI Infra), SK Hynix. “We will continue our position as the world's number one AI memory supplier while constantly preparing next-generation memory products to meet the challenges of the AI era.”
